Ekipi moko ya bolukiluki oyo etambwisami na Prof.Huang Xingyi .mpeMonganga Shi Kunming .euti naUniversité ya Shanghai Jiao Tong .asili kosala .Bande multicouche thermiquement conductrice et isolante électrique (MTCEIT) .. Innovation oyo epesaka nzela na réduction ya température ya CPU ya jusqu'à to .9 degré ., kopesa solution ya sika mpo na dissipation ya chaleur na ba appareils électroniques compacts.
Ba sandwichs ya structure ya mtceit .Papyé ya graphène .(Noyau ya conductivité thermique ya likolo) kati na .BNNs-Ba couches ya adhésifs ya PBcoea oyo etondi na bato ., esangani na .Caoutchouc silicone (SR) Backing composite .Etondisami na .nitrure ya bore hexagonale (H-BN) .Ba flakes. na bonene ya pene na .300 μm, kasɛti yango ekokisaka .Na-Bokumbi ya molunge ya mpepo ya 121,22 W/M·K ., a Résistivité ya volume ya 5.07×10111 Ω·cm ., mpe A .Weibull Bokasi ya bopanzani ya bizaleli ya 36,9 kV/mm ..
Na ba tests ya solo-Mokili, MTCEIT ekitisaki ba .Température ya CPU ya ba ordinateurs portables mince par 9 degrés .mpe stabilisé .Fluctuation ya taux ya cadre ya vidéo na moke to ekokani na 0,1 fps .Na Ultra-Ba smartphones ya minene oyo ezangi refroidissement active.
Boyekoli yango, oyo ezali na motó ya likambo ."Papili ya graphène-Bases multicouches basées thermiquement conducteurs na isolation électrique exceptionnelle mpo na dissipation ya flux ya chaleur ya likolo,"ebimisamaki na .Matériaux fonctionnels avancés (AFM) ..
Figure 1. Bokeli ya MTCEIT.
(a) Illustration schématique ya système ya dissipation ya chaleur na ba appareils électroniques compacts oyo esangisi mtceit.
(b) Bopanzani ya molunge ya likolo ya ba bandes na ba structures ekeseni na se ya ba conditions ya état ya kokita na ba simulation ya ba éléments finis.
(c–e) Maximum equilibrium temperature of the heat source in the finite element simulations as a function of (c) the thickness ratio of each layer, (d) the in-plane (κ//) and through-plane (κ⊥) thermal conductivity of the adhesive layers, and (e) the interfacial thermal resistance between the adhesive layer and the ultrahigh-κ// layer as well as between the Couche ya adhésif na couche ya sima .
Figure 2. Structure na ba propriétés mécaniques ya MTCEIT.
(a) Bililingi ya optique ya papier ya MTCEIT mpe ya graphène ya mombongo.
(b) Cross-Sectional mpe (c) Ba images ya SEM ya contact compact intercouche ya MTCEIT.
(d) Spectre ya EDS mpe (E) Motindo ya XRD ya MTCEIT.
f) kogumbama mpe (g) kobongisa ba états ya MTCEIT.
(h) courbe ya stress–déformation ya traction ya MTCEIT.
Figure 3. Conductivité thermique na isolation électrique ya ba MTCEITS.
Figure 4. Dissipation ya chaleur ya ordinateur portable ya pete.
(a) Image optique ya carte mère ya ordinateur portable. Bonene ya MTCEIT ezali 130 mm × 60 mm.
(b) Illustration schématique ya système ya dissipation ya chaleur ya CPU simplifié.
(c) Ba images thermiques ya infrarouge ya ordinateur portable.
(d) Bokeseni ya molunge mpe (e) molunge ya CPU na 1200 s. Inset na (d) ezali kolakisa image optique ya ordinateur portable oyo emekami.
Ba tests nionso esalemaki na ba conditions normales ya fonctionnement. Température emekamaki na capteur ya CPU oyo etongamaki{1}}na oyo etongamaki mpe elandami na nzela ya logiciel AIDA64 Extreme.
Figure 5. Dissipation ya chaleur ya smartphone ultra-Minthin sans refroidissement active.
